With the demand for archival data storage skyrocketing, a new research initiative is looking to take advantage of an efficient and robust information storage medium that has proven itself through the

Pleora Technologies has introduced the vision industry’s first artificial intelligence (AI) platform that simplifies the deployment of advanced machine learning capabilities to improve the reliability

Imagination Technologies has opened a new design centre in Timisoara, Romania.

Arrival, the UK electric van manufacturer, has secured an £85m investment from South Korean car firms Hyundai and Kia – a cash injection which values the business at £3bn.

Mouser Electronics has now become an authorised distributor for GigaDevice.

Microchip Technology has joined the Responsible Business Alliance (RBA), a nonprofit coalition of companies dedicated to the improvement of social, environmental and ethnical conditions in their globa

ROHM and STMicroelectronics have signed a multi-year silicon carbide (SiC) wafers supply agreement with SiCrystal.

Plextek, the design consultancy, has joined the Arm Pelion and Mbed Partner Ecosystem, a group of embedded and cloud companies, component manufacturers, system integrators and OEMs driving innovation

Essentium, an innovator in industrial Additive Manufacturing (AM), has unveiled the second in a series of findings from independent global research on the current and future use of industrial 3D print

Littelfuse, a manufacturer of technologies in circuit protection, power control and sensing, has announced the Gate Drive Evaluation Platform (GDEV).

Microchip has unveiled what it claims is the industry’s first space-qualified Ethernet transceiver – a radiation-tolerant device based on a Commercial Off-the-Shelf (COTS) solution suitable for applic

Wind River has announced the acquisition of Star Lab, a leader in cybersecurity for embedded systems.

Cadence Design Systems is expanding its collaboration with Broadcom for the creation of semiconductor solutions targeting next-generation networking, broadband, enterprise storage, wireless and indust

With applications in autonomous vehicles, robots and drones, as well as security researchers are continuing to strive to develop a 3D sensor that is both compact and easy to use.

CISSOID, a supplier of high temperature semiconductors, has developed robust Gate Drivers for XM3 SiC MOSFET power modules from Wolfspeed.

Global demand for connected equipment in the healthcare sector is forecast to increase at a rate almost 2 percentage points higher than the market average for the overall smart building market, accord

AMD’s EPYC processors have been selected by the European Centre for Medium-Range Weather Forecasts (ECMWF).

Italian telecommunications operator, TIM has successfully completed the first connection in Europe able to permanently overcome the 2Gbps speed on a 5G live commercial network with 26 Gigahertz (GHz)

imec has presented the first functional GaAs-based heterojunction bipolar transistor (HBT) devices on 300mm Si, and CMOS-compatible GaN-based devices on 200mm Si for mm-wave applications.

DOOGEE, a smartphone company founded in Spain in 2013, continues its ‘modular smartphone’ approach with the launch of a new device.

Kenworth and Dana have announced their collaboration on electric powertrain development for medium duty Kenworth battery electric vehicles.

New research from Berg Insight, the M2M/IoT market research company, suggests that the number of installed smart waste management sensors will soar from 379,000 worldwide in 2018 to 1.5 million in 202

StoreDot, a specialist in ultra-fast charging (UFC) technology for electric vehicles, has set up a new company to drive development of its MolecuLED wavelength conversion technology.

Anglia has significantly expanded its inventory profile on Hirose interconnect products and is now offering all parts with no minimum order quantity (MOQ) to further support designers and SME manufact

3D motion tracking technology company, Xsens, has unveiled a new wearable sensor development platform.

Synopsys has completed the acquisition of Tinfoil Security, a provider of dynamic application security testing (DAST) and Application Program Interface (API) security testing solutions.

The Cambridge company, Evonetix, has announced that it is collaborating with imec to scale-up chip-based technology production of its third generation DNA synthesis platform.

Oxbotica, a specialist in vehicle autonomy, and Navtech, a radar solutions company, have announced their joint product development of a radar-based navigation and perception system to be launched in 2

Siemens Digital Industries Software is partnering with Arm to bring leading edge IP, methodologies, processes and tools together to help automakers, integrators and suppliers deliver next-generation p

Element Materials Technology (Element) has acquired the connected technologies business, PCTEST Engineering Laboratory (PCTEST), significantly strengthening its position in testing and certification s

Vayyar Imaging, a leader in 4D radar imaging technology, has announced the world’s first 60GHz automotive-grade MIMO radar-on-chip (ROC).

Green Hills Software and Real-Time Innovations (RTI), the Industrial Internet of Things (IIoT) connectivity company, are collaborating in the automotive industry with a demonstration of safe and secur

CML Microcircuits has unveiled the EV6550DHAT, a Raspberry Pi Hardware Attached on Top (HAT) compatible evaluation and development board making the CMX655D ultra-low power voice codec available to hob

Digi-Key has announced the signing of a global distribution partnership with Anderson Power Products (APP).

University of Toronto Engineering researchers have developed a super-stretchy, transparent and self-powering sensor that records the complex sensations of human skin.

what3words and Speechmatics have launched a new end-to-end speech recognition and post-processing API for developing new location services.

ams has been demonstrating the future of personal audio, with a new ready-to-use Earbud Innovation Demo Kit, at CES in Las Vegas.

Silicon Labs has announced new Bluetooth system-on-chip (SoC) solutions that combine security features, wireless performance, energy efficiency, and software tools and stacks.

Renesas Electronics Corporation has announced a new highly integrated power management IC (PMIC) for automotive applications.

Nexperia, a specialist in discrete and MOSFET components and analogue and logic ICs, has announced that Wingtech Technology – a Chinese computer and telecom equipment manufacturer – has obtained a con

Imagination Technologies has announced that it has signed a new multi-year licensing with Apple, giving the US company continued access to Imagination’s IP.

Bosch has announced that it has developed a sensor that lets cars “see” a three-dimensional view of the road, aiming to lower the cost of technology that could help to speed up the development of self

The Energy Emergencies Executive Committee (E3C) has published a report reviewing a power cut last August that affected over 1 million customers across England and Wales and some parts of Scotland.

New research from the IoT analyst firm Berg Insight, says that the installed base of smart street lights will reach 31.2 million in 2023.

u-blox has announced its SARA-R410M-73B module has been certified in South Korea for use on SK Telecom’s LTE-M cellular network.

Researchers have reported what they say is the first achievement of an all-epitaxial, distributed Bragg reflector (DBR)–free electrically injected surface-emitting green laser.

NXP has announced its new S32G vehicle network processors which it claims will mark a significant turning point in the way vehicle architectures are designed and implemented.

Renesas has announced that following the successful integration of Integrated Device Technology (IDT) in the U.S.it has begun operating in the market under the name of Renesas Electronics America as o

Wind River has announced software support for the latest NXP S32G processors which combine hardware security; ASIL D safety; high-performance processing; and network acceleration for service-oriented

Infineon Technologies has unveiled what it says is the world’s smallest and most powerful 3D image sensor at CES in Las Vegas.

CEVA, a licensor of wireless connectivity and smart sensing technologies, has unveiled SenslinQ, its first integrated hardware IP and software platform that aggregates sensor fusion, sound and connect

Nexeon – the Oxfordshire company developing silicon materials for next generation Li-ion batteries – is sampling silicon-enhanced batteries to potential customers for evaluation.

NXP Semiconductors has expanded its EdgeVerse portfolio with the i.MX 8M Plus application processor.

Semiconductor manufacturer Diodes Incorporated has received a £13.7m funding package from Scottish Enterprise towards a £47m project enabling its future growth in Greenock.

Qualcomm Technologies has unveiled its newest addition to the company’s portfolio of automotive products with the new Qualcomm Snapdragon Ride Platform.

Harman International, a subsidiary of Samsung Electronics, has announced its EV Plus+ Solutions, a new audio and communications solutions bundle that's been designed specifically for the fast grow

Researchers, at the Georgia Institute of Technology, have demonstrated a new all-optical technique for creating robust second-order nonlinear effects in materials that don't normally support them.

The Bluetooth Special Interest Group (SIG) has announced the upcoming release of LE Audio, the next generation of Bluetooth audio.

SiFive, the provider of commercial RISC-V processor IP and silicon solutions and CEVA, a licensor of wireless connectivity and smart sensing technologies, have announced a partnership to enable the de

Intel has unveiled new products, partnerships and platform-level innovations to support mobile computing at CES 2020.

Boréas Technologies, a developer of ultra-low-power haptic technologies, is demonstrating the BOS1211, a low-power high-voltage piezoelectric driver integrated circuit (IC) to enable high-definition (

Texas Instruments (TI) has introduced the Jacinto 7 processor platform bringing enhanced deep learning capabilities and advanced networking to address challenges associated with advanced driver assist

Swedish sound specialist Dirac and NXP Semiconductors are to collaborate combining a powerful audio chipsets with a digital audio platform.

The leading provider of automated driving technologies, AImotive, has announced that its aiSim simulator for automated driving development has achieved ISO 26262 tool certification.

Intel has acquired Habana Labs, an Israel-based developer of programmable deep learning accelerators for the data centre in a deal that values the company at $2 billion.

Arrow Electronics has collaborated with ON Semiconductor and manufacturer Geniatech to develop MuSeOn 1.1, an industrial, proof-of-concept workplace safety solution.

AImotive, a supplier of scalable modular automated driving technologies, has begun shipment of the latest release of its aiWare3 NN (Neural Network) hardware inference engine IP to its lead customers.

Silicon Labs and the Z-Wave Alliance have announced plans to open the Z-Wave Specification as a ratified, multi-source wireless standard available to all silicon and stack vendors for development.

A flexible capacitive identification tag that communicates with standard touch screens (C-touch) has been developed by Imec, TNO, and Cartamundi.

Two new research projects have been allocated funding from the WEEE Fund’s Technical Research programme. WEEE stands for ‘Waste Electrical and Electronic Equipment’.

Amazon, Apple, Google, and the Zigbee Alliance have formed a working group to develop an open standard for smart home device connectivity.

The free webinar with RS Components and new electronics will go live on Wednesday 8 January at 3:00pm.

PCB Live exhibitor OKW has recently launched two new adapters that enable any small plastic enclosure to be mounted direct onto a DIN rail – saving space and significantly speeding up installation.

Zuken has unveiled a number of advanced high-speed design features for its recently launched eCADSTAR connected PCB design platform.

KIOXIA Europe has announced the development of a three-dimensional semi-circular split-gate flash memory cell structure.

ams has introduced an inductive position sensor for high-speed, automotive and industrial electric motors.

Arrow Electronics has partnered with Microshare Inc. to provide Internet of Things (IoT) solutions at scale to global enterprise customers.

The Jaguar E-type was introduced in March 1961 and promised a top speed of 150mph. John Coombs was a successful racing driver in the 1940s and ’50s and his family business included a thriving Jaguar d

UltraSense Systems has launched an ultrasound sensor-on-chip that it says enables touch sensing through a range of materials, including metal, glass, wood, ceramic and plastic.

ON Semiconductor has released the first two devices from its new VE-Trac family of power modules for high voltage automotive traction inverters.

Renesas Electronics has announced that its power solutions, as well as timing solutions from IDT, wil support the Xilinx Versal adaptive compute acceleration platform (ACAP) devices featured on the Xi

SEGGER has released Ozone V3.10, a major update to its full-featured graphical debugger and performance analyzer.

​Mobica has launched its 'Digital Cockpit' concept in partnership with Mediatek.

Southampton University spin-out, AccelerComm, has announced the 5G NR LDPC version of its error correction software, which reduces latency up to 16x to support numerology 4 in 3GPP 38.211 and also pro

Global semiconductor manufacturing equipment sales are expected to drop 10.5 percent to $57.6 billion in 2019 from last year’s historic peak of $64.4 billion, according to new research from SEMI.

In a research result that could potentially expand the market for tiny energy-storage units in medical implantable, injectable and wearable solutions, CEA-Leti has fabricated all-solid, inorganic thin

Aspinity, a US company that specialises in edge intelligence for always-on sensing devices, has demonstrated what is says is the world’s most power-efficient end-to-end voice wake-up solutions for voi

Samsung has carved out a commanding lead in the newly developing 5G smartphone market, with the company accounting for three-quarters of worldwide shipments in the third quarter, according to research

Wind River has announced RISC-V open architecture support for its industry-leading VxWorks® real-time operating system (RTOS).

The electronic components market has been growing steadily over the past year and this trend is set to continue in 2020 and beyond, according to Jezel Hardern, Managing Director, Rutronik UK & Ire

Connected devices are flooding into our homes and our workplaces, yet embedded engineers still need to reach a consensus on how these should be maintained.

TowerJazz, the specialty foundry leader, and the Technion, the Israel Institute of Technology, have successfully developed a breakthrough technological platform that uses memristor devices featuring a

Dialog Semiconductor and Flex Logix Technologies have announced a strategic agreement for Dialog to license Flex Logix’s EFLXÒ Embedded Field-Programmable Gate Array (eFPGA) technology.

Latent Logic, a start-up focused on the development of driverless cars, has announced it has been acquired by Waymo, part of Google parent company Alphabet’s portfolio.

RECOM Power, a global manufacturer of power supply products, has launched digital models for its entire product catalogue in collaboration with SnapEDA.

Semtech, Wilhelmsen and The Things Industries (TTI) will partner to help deliver what they describe as cost-effective, robust and proven IoT solutions to the maritime shipping industry.

Oxbotica has signed a Memorandum of Understanding with ZF to integrate its autonomous driving software with ZF’s automotive-grade ProAI compute platform and sensor sets.

UK-based graphene electronics technology company Paragraf has added £3.4m to its series A round, bringing the total to £16.2m.

Smiths Interconnect has opened a new Qualification and Test laboratory at its site in Dundee, Scotland.

Microchip Technology is opening the Early Access Program (EAP) for the PolarFire system-on-chip (SoC) field programmable gate array (FPGA).