RS Components (RS) has introduced the latest version of its free-for-use DesignSpark PCB electronics CAD software.
Purdue University engineers have developed transistors that can process and store information on one device.
Bosch Sensortec has launched Bosch Light Drive, a smartglasses module that consists of MEMS mirrors, optical elements, sensors, and onboard processing.
Nexeon, which is developing silicon materials for next generation lithium ion batteries, has acquired three sets of patents relating to the use of silicon in lithium ion battery anodes.
Plessey have successfully developed the world’s first GaN on Silicon-based Red LED.
At this year’s IEEE International Electron Devices Meeting, imec, the research and innovation hub in nanoelectronics and digital technologies, published an in-depth study looking at scaled transistor
UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, is introducing four new SiC FETs, with RDS(ON) levels as low as 7mohms.
Lynx Software Technologies, a supplier of platform software technologies, has announced that the F-35 Joint Strike Fighter Program Office has accepted the recommendation from Lockheed Martin to adopt
ADLINK Technology, a leader in edge computing, has joined forces with Intel and Amazon Web Services (AWS) to simplify artificial intelligence (AI) at the edge for machine vision.
According to a new study published by Polaris Market Research, the worldwide anti-drone market is anticipated to reach over $3bn by 2026.
CAP-XX, the Sydney supercapacitor specialist, is to buy the supercapacitor production lines of its licensee Murata and relocate them from Japan to Sydney, and is planning to begin producing Murata’s t
Imagination Technologies has announced the tenth generation of its PowerVR graphics architecture, the IMG A-Series.
AWS has added a musical keyboard to its portfolio of educational devices that aim to help developers learn machine learning (ML) in “fun, practical ways”.
The US-based automation specialists Emerson has announced that it has completed the purchase of Intelligent Platforms, a division of General Electric.
AMD has announced a new open ecosystem for OEMs to create and customise high performance mini PCs.
OKdo, part of Electrocomponents, has announced that it is adding the NVIDIA Jetson Nano Developer Kit to its range.
Slightly bending semiconductors made of organic materials can roughly double the speed of electricity flowing through them and could benefit next-generation electronics such as sensors and solar cells
Cadence Design Systems has announced that it has entered into an agreement to acquire AWR Corporation, a wholly owned subsidiary of National Instruments (NI).
Harwin is continuing to invest in and support the further promotion of science, technology, engineering and mathematics (STEM) to younger generations.
Imagination Technologies has announced that UNISOC, a fabless semiconductor company, has licenced its latest generation of neural network accelerator (NNA), IMG Series3NX for use in future system-on-c
The Small Robot Company, a British agritech start-up for sustainable farming, has announced the world’s first non-chemical precision robotic weeding for cereal crops
The world’s first ISO approved drone standards have been announced by the International Organisation for Standardisation (ISO), following a 12-month period of consultation with drone professionals, ac
Boréas Technologies, a developer of ultra-low-power haptic technologies, has introduced the BOS1901CW, a Wafer Level Chip Scale (WLCSP) version of its flagship low-power piezoelectric driver integrate
AFC Energy, a hydrogen power company, has launched a zero emissions electric vehicle (EV) charger based on hydrogen fuel cell technology. The self-contained, zero emission charging system overcomes is
The Wireless Broadband Alliance (WBA), the body that is leading the development of next generation Wi-Fi services, has confirmed the successful completion of its phase one trial of Wi-Fi 6 infrastruct
Super Micro Computer, a specialist in enterprise computing, storage, networking solutions, has unveiled solutions for 5G cell tower deployments that leverage fully-configurable SuperServers based on 2
Qualcomm Technologies has introduced the Snapdragon 865 5G Mobile Platform, which combines an advanced 5G Modem-RF System with a mobile platform to deliver what the company says will be ‘unmatched con
Mouser Electronics has added a number of new features to the ECAD resources on its product detail pages on its website, Mouser.com.
The global semiconductor market appears destined for a year of double-digit decline, despite some signs of growth in the critical memory segment, after revenue plunged 14.7 percent in the third quarte
OnLogic has integrated SimScale’s cloud-based simulation platform into its design testing process.
The Electronic Components Supply Network (ecsn) has said that a combination of geopolitical uncertainties and lack of visibility in the market overall have limited its ability to accurately forecast 2
Electronics assembly requires high accuracy for parts with miniature dimensions. Yet concurrently, the production of electronic sub-assemblies and components also requires high speed, with processes t
The deadline for the Semta skills awards – one of industry’s most prestigious celebrations of engineering skills – has been extended until 11th December.
MediaTek has launched Dimensity, a new family of 5G system-on-chips (SoCs) intended to provide improved levels of connectivity, multimedia, AI and imaging innovations for smartphones.
AutoChips, the Chinese automotive electronics chip design company, in partnership with X-FAB Silicon Foundries, has started volume production of a highly advanced Tire Pressure Monitoring System (TPMS
A study conducted by researchers at the National University of Singapore has uncovered a way to encode computational information without using electrical current. This could lead to faster technologic
Farnell, along with element14, are expanding the AI products and resources available to help engineers develop new solutions leveraging the technology.
Fareham-based electronic enclosures manufacturer OKW has added interesting new laser marking technology to its wide range of customisation services, and will be highlighting examples of it at the fort
One of the UK’s leading suppliers of board-to-board interconnect systems will be bringing examples of its latest innovations for visitors to examine and discuss at the forthcoming PCB Live exhibition
WISeKey, ON Semiconductor and Tatwah have released what they say is the world’s first secure IoT beacon device.
The UK is set to move to the forefront of EV charging after it was announced that wireless/induction charging will soon arrive in UK streets and car parks.
Cambridge-based Iotic has secured investment of €7.5/£6.5 million to accelerate growth and meet increasing demand for its leading digital twin technology
Skeleton Technologies, a specialist supplier of ultracapacitors and ultracapacitor energy storage systems, is bringing a new ultracapacitor product platform, the SkelCap SCA0300, to market to address
Panasonic is selling its loss-making semiconductor unit to Taiwan’s Nuvoton Technology for $250 million as the Japanese electronics giant looks to raise profits.
One of Trustees at the UKESF, Prof Bashir Al-Hashimi, the Dean of Engineering & Physical Sciences at Southampton, argues that there needs to a concerted effort to change the approach to engineerin
Samsung reclaimed the No.1 slot in the global smartphone display market in Q3 as the company capitalised on record-high demand for AMOLEDs, according to IHS Markit.
Audi, the luxury division of automotive giant Volkswagen, is set to cut one in ten jobs, in a move intended to free up billions of euros to fund the company's shift towards electric vehicle produc
Alan Banks opened the recent TechWorks Summit with a look back on what has been accomplished since his appointment as chief executive back in March.
Arrow Electronics has been appointed as the first reseller for the MindSphere Program for industrial Internet of Things (IIoT) and solution and technology providers in the Europe, Middle East and Afri
STMicroelectronics is working with maxon, a supplier of precision-motor provider and a member of the ST Partner Program, to accelerate the design of robotics applications and industrial servo drives.
MediaTek has announced that it is partnering with Intel to bring MediaTek’s new 5G modem to PCs.
Aldec has launched the HES-MPF500-M2S150 Development Kit, to aid engineers in the development of FPGA-based embedded systems that will use devices from either or both of Microchip’s PolarFire or Smart
Researchers based at the University of Waterloo in Canada, have developed a method that could be used to establish universal standards for measuring the performance of quantum computers.
Weebit Nano, a developer of next generation memory technology for the semiconductor industry, has confirmed test results showing its arrays can be manufactured for embedded applications with just a si
A team of National University of Singapore (NUS) researchers have developed a new metal-based material for use in soft robots.
Bridgetek has released a user interface that brings standalone smart home systems into a single platform.
Scientists from the Tokyo Institute of Technology (Tokyo Tech) and the University of Tokyo (UTokyo) have developed a three-valued memory device inspired by solid lithium-ion batteries.
Imec will test a technology for monitoring astronauts’ health status under zero gravity conditions using NASA funding.
Panthronics, a fabless semiconductor company specialising in high performance wireless technology, has announced the launch of a new near-field communication (NFC) reader IC.
Future Facilities has launched Release 14 of its thermal simulation software, 6SigmaET. The latest release includes significant modelling and optimisation enhancements, including the company’s ‘fastes
The Fraunhofer Institute for Photonic Microsystems (IPMS) has combined Li-Fi and Time Sensitive Networking (TSN) to enable real-time deterministic data transmission wirelessly.
AImotive, HERE Technologies and Vodafone have completed a nine-month project to build a proof-of-concept for automated valet parking.
UTAC has been awarded the automotive-related quality standard ISO26262 for its manufacturing facility UTAC Thailand (UTL) in Bangkok.
Google has today launched Stadia, a video game platform that delivers 'instant access' to games on any type of screen – from TVs and laptops, through to desktops, tablets or mobile phones.
Cree and STMicroelectronics are to expand and extend an existing multi-year, long-term silicon carbide (SiC) wafer supply agreement to more than $500 million.
Infinera has unveiled an X-haul-optimised packet optical switch that it says is purpose-built for Time-Sensitive Networking (TSN).
The summer quarter of 2019 provided a significant decline in sales for the European components distribution market.
RS Components (RS) has introduced a referral programme to incentivise members to introduce friends and colleagues to its ‘DesignSpark’ engineering platform.
ams has announced the completion of a consortium project to develop and launch what it says is the world’s first light sensor with fully integrated optical stack.
Teledyne e2v has announced its EV12DS480 digital-to-analog converter (DAC) has been approved for use in space applications after undergoing irradiation tests.
Wind River has announced the Wind River Cloud Platform, a Kubernetes-based offering for managing edge cloud infrastructure.
Super Micro Computer, a specialist in enterprise computing, storage, networking solutions, and green computing technology, is collaborating with Intel on AI solutions that are validated on the Intel
NXP Semiconductors (NXP), Dongfeng Venucia and Hangsheng Electronics have announced that the Venucia T90 e-cockpit, “Venucia 3.0 PLUS,” has gone into mass production as the three companies look to bri
STMicroelectronics has introduced a new generation of memory chips that combine improved storage density with speed and reliability.
Smart Equipment Technology (SET), a leading supplier in high accuracy die-to-die and die-to-wafer bonders has announced the release of NEO HB.
Rohde & Schwarz has developed the ATS1500C antenna test system, a new test chamber for high performance radar testing, offering a markedly improved indirect far-field testing performance.
A planning application has been submitted for the development of the National Manufacturing Institute Scotland (NMIS), which will be situated at the centre of the Advanced Manufacturing Innovation Dis
Three new centres to train the next generation of engineers could be built on Hereford’s Enterprise Zone after the Marches LEP agreed a £5.66 million funding package for the city’s proposed new unive
The GSA (Global mobile Suppliers Association) has said that it has welcomed the decision of the global spectrum regulators at the ITU’s World Radio Conference 2019 (WRC-19) to identify several millime
A new power saving chip could significantly reduce or eliminate the need to replace batteries in Internet of Things (IoT) devices and wearables.
CAHORS Group has integrated Semtech’s LoRa devices and the LoRaWAN protocol into its new Sentinel line fault detection solutions for simplified defect monitoring in smart grid networks.
Blaize has unveiled what it says is the first true Graph-Native silicon architecture and software platform built to process neural networks and enable artificial intelligence (AI) applications with un
Xilinx has expanded its automotive-qualified 16 nanometer (nm) family with two new devices – the Xilinx Automotive (XA) Zynq UltraScale+ MPSoC 7EV and 11EG.
This year's Hitex Arm User Conference will be held on Thursday 28th November. It will bring together experts to present new and emerging technologies for Cortex-M microcontrollers.
Arrow Electronics has expanded its sensor portfolio through an agreement with InvenSense.
Wind River is collaborating with Xilinx to provide carmakers with a flexible, high-performance platform for delivering safe and secure automated vehicles.
RS Components is now stocking the XP Power ALM200 series of external AC-DC power supplies, designed to deliver high efficiency and low standby power meeting the latest environmental guidelines.
Silicon IP and chip provider Rambus has announced it now offers a comprehensive and optimised interface solution designed for PCI Express (PCIe) 5.0.
BittWare has expanded its offerings and solutions to further address the growing need for computing technology that combines memory bandwidth and advanced cooling.
Adesto has announced that will work with utility providers in Tunisia, Egypt and other countries in Africa and the Middle East to pilot a new smart meter.
Cadence Design Systems has announced UltraLink D2D PHY IP, a high-performance, low-latency PHY for die-to-die connectivity targeting the AI/ML, 5G, cloud computing and networking market segments.
Hyperstone has announced that it sX1 SSD flash memory controller has now entered into mass production.
PragmatIC has developed a patented semiconductor device platform to provide engineers with a customised and more flexible design environment for integrated circuits.
Efinix is rolling out the Trion T120 FPGA, a device featuring a small, high-density fabric, a hardened DDR memory controller and hardened MIPI CSI-2 and PHY interfaces.
Embedded systems consultancy ByteSnap Design has conducted research to understand what electronic design businesses expect of the future.
Mouser Electronics has announced a global distribution agreement with SEARAN, a provider of Bluetooth wireless connectivity.
Nordic Semiconductor has unveiled a new high-performance application processor with a fully programmable, ultra-low power network processor.
Teradyne has completed its acquisition of AutoGuide Mobile Robots, a supplier of high payload autonomous mobile robots (AMRs).
Harwin has broadened the scope of its portfolio of ready-made high-reliability cable assemblies.
A new EU innovation hub will give researchers in European academic institutes the chance to turn breakthrough photonics technology concepts into industrially relevant demonstrators.