The Synergy Platform provides developers with access to a complete embedded platform, starting with an application programming interface to leverage a full software framework built around Express Logic’s X-Ware package.
“Every design team in the world, including Europe, is facing a 50% increase in new project starts over the last couple of years and this is placing a massive pressure on the designer,” added Andy Harding, director of core marketing at Renesas.
“We launched the Synergy platform last year and are accelerating its release this year, so it’s the perfect time to engage with Mouser, which is active in the digital space, effective at new product induction and has a great reach into the design community worldwide.”
The Synergy Software Package is designed to remove obstacles facing design engineers and to speed time to market for IoT, industrial and real-time operating system-based applications. It removes from developers the need to create and maintain low level repetitive software for each of their embedded projects. The platform also integrates a range of scalable ARM Cortex-M based MCUs.
Nexperia added three series of common mode EMI filters with integrated ESD protection. The filters offer support for USB 3.1 Type C, HDMI 2.0 and MIPI M-PHY interfaces and provide TrEOS ESD protection diodes in the same package. Designers can determine at a late stage whether they need to include EMI filtering, without being concerned about PCB layout spins. Turn-on time is 0.5ns, which is said to enable devices to withstand up to 20kV contact discharge. The company also revealed a thermally-enhanced, loss-free package for automotive power MOSFETs which it claims has a footprint 80% smaller than industry standard devices.
Congatec showed SMARC 2.0 modules supporting USB-C connectivity aimed to simplify the use of embedded technology. The USB-C functionalities include USB 2.0, USB 3.1 Gen 1 support with data rates of up to 5Gbit/s and the alternate modes for Display Port 1.2 and USB Power Delivery, supporting a power envelope of up to 100W. It also showcased a best practice design solution for the simplified orchestration of wireless sensor networks. The solution is based on the application ready Congatec Cloud API for IoT gateways that can integrate local sensor networks into cloud solutions. The main software components of the best practice solution are the different Cloud API function modules, as well as the demo and test modules for provider independent IoT clouds.
Future Electronics is extending its franchise distribution agreement with display manufacturer Tianma NLT to include EMEA. With the franchise extension, Future can offer customers a range of displays in sizes ranging from 1 to 20in, with resolution up to Full HD and with various configuration and customisation options, including optical bonding and touchscreen overlays.
Farnell had several announcements, including the release of an Intel Curie module based board called tinyTILE and the latest BeagleBone open hardware computer. Created in partnership with Intel, tinyTILE measures 35 x 26mm and can be programmed using either the Arduino ID, Intel Curie Open Developer Kit or Anaren Atmosphere for applications such as social media, sports and fitness devices. Meanwhile, BeagleBone Blue is built specifically for use in the development of robotics and autonomous vehicles, possessing flexible wireless networking capabilities and a real-time capable Linux system. Farnell also announced the Pi Desktop, said to convert Raspberry Pi 2 and 3 into a desktop computer with an integrated real time clock and intelligent power management controller.
Adlink introduced the VPX3010 series, rugged 3U VPX processor blades with a 12 core Intel Xeon processor D-1500 SoC for server-grade computing performance. The SWaP-optimised board supports a range of VPX and VPX REDI VITA specifications, as well as VITA 65 OpenVPX Architecture Framework and MIL-STD-810G. It is available in convection and conduction-cooled formats, with conformal coating for military and aerospace applications. Other newly released products include the NEON-1021 Intel Atom E3845 processor-based smart camera; EOS-1300 4CH PoE Compact Vision System; and PCIe-GIE72/74 2/4CH GigE Vision PoE+ frame grabbers.