Fuji Electric and chip manufacturer Infineon Technologiesagreed to extend the supplier base for power modules deployed in automotivehybrid and electrical vehicles (HEV). At the PCIM Europe trade show inNuremberg, the two companies announced their agreement on a joint commonfootprint for automotive IGBT power modules using Infineon's Hybrid PACK 2power module. In response to the need for supply security for HEV powermodules, the companies agreed on the size of the module, the position ofpin-outs, the use of the pin-finned copper base plate, and on other mechanicalfeatures.
The agreement comprises the HybridPACK 2 module, theFS800R07A2E3 featuring 650V/800A. It effectively makes the IGBT power modulesfrom these two vendors interchangeable. For customers in the automotiveindustry, the move translates into a second-source option for the power modulesin question, doing away with the undesired dependence from a single vendor.
Infineon developed its power modules HybridPACK 2 for directliquid-cooled systems as common in hybrid vehicles and electrical vehicles.According to Infineon, the HybridPACK 2 modules offer the industry's smallestfootprint at the given high power density. This is approximately 20% smallerthan other modules on the market, the company claims.
Today's electronic control systems for full hybrid cars andelectrical vehicles equal the size of two standard shoe boxes, weighing anaverage of 30 kilos. A system with HybridPACK 2 power module technology is onlyabout the third its size and only weighs approximately 20 kilos compared toother state-of-the-art solutions. The pin-finned copper base plate inHybridPACK 2 not only enhances thermal performance, but also increasesreliability.
The HybridPACK 2 modules of Infineon are available inhigh-volume. Fuji plans to have power modules with HybridPACK 2 footprintavailable as of 2013.
Further information is available atwww.infineon.com/automotive and www.infineon.com/hev andwww.infineon.com/hybridpack. For further information on Fuji, visitwww.fujielectric.com.
This story was originally posted by EETimes.
