mmWave 5G package test solution

Addressing the technical challenges associated with 5G mmWave package part test, this solution helps reduce the cost and risk of delaying time to market for semiconductor manufacturers that produce mmWave 5G ICs.

NI, Tessolve and Johnstech collaborated to demonstrate a quad-site mmWave 5G IC packaged part test solution. It includes a mmWave interface board designed and manufactured by Tessolve and mmWave contactors designed by Johnstech and rated up to 100 GHz.

A key element of the solution is the NI Semiconductor Test System (STS). Part of the demonstration included a multisite mmWave test STS configuration optimised for 5G power amplifiers, beamformers and transceivers. A major benefit displayed was the modularity that allows reuse of software and baseband/IF instrumentation with modular mmWave radio heads to address current and future mmWave frequency bands of interest.

Semiconductor manufacturers interested in the solution can find STS information at ni.com/sts.