DSP chip makes mobile sound louder

  

An audio DSP chip from NXP Semiconductor NV (Eindhoven, The Netherlands) is able to boost the output power of small speakers used in smartphones and tablet computers by a factor of five while still preventing damage to the speakers.

The use of a CoolFlux DSP and optimization algorithms on the TFA9887 chip is able to drive 2.6 watts rms into micro speakers previously rated for 0.5 watts. This is claimed to give mobile phones, portable music players and tablets louder sound and deeper bass response. Safety features include adaptive excursion control and real-time temperature protection, and the TFA9887 monitors speaker behavior through current-sensing amplifier.

The TFA9887 optimizes the audio signal based on the movement of the speaker and because the speaker is protected it can more power across more frequencies to make the sound louder. The chip also provides clip avoidance to cope with sagging power supply and a dc-dc converter to maintain performance despite battery undervoltage.

The advanced, embedded algorithms require no separate licensing. Additional tools allow designers to customize audio sound quality and choose how to optimize mobile device performance.





Shawn Scarlett, director of marketing for mobile audio products talks about the TFA9887 audio IC



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