The new REAL3 single-chip solution, developed in collaboration with pmdtechnologies, measures 4.4 x 5.1 mm and is the fifth generation of successful time-of-flight deep sensors from Infineon.
Andreas Urschitz, President of the Power Management and Multimarket Division at Infineon, said of the REAL3 chip: “It’s robust, reliable, powerful, energy efficient and at the same time decisively small. We see great growth potential for 3D sensors, since the range of applications in the areas of security, image use and context-based interaction with the devices will steadily increase.”
In addition to its small dimensions, which allow it to be incorporated into even the smallest devices with just a few elements, the chip provides high resolution data with low power consumption. The sensor also allows the device to be controlled via gestures, so that human-machine interaction is context-based and without touch.
The new 3D image sensor chip (IRS2887C) was developed in Graz, Dresden and Siegen, and the companies say production will begin in the middle of this year.
