As a part of the collaboration, Kyocera will provide the integration of power and data delivery to the processor with organic packages, module substrates and motherboard designs. Vicor will provide Power-on-Package current multipliers enabling high density, high current delivery to processors.
The collaboration is intended to address the rapid growth of higher performing processors, which has created proportionate growth and complexity in high-speed I/Os and high current consumption demands.
Vicor’s Power-on-Package technology enables current multiplication within the processor package, allowing for higher efficiency, density, and bandwidth. Providing current multiplication within the package can reduce interconnect losses by up to 90 percent, while allowing processor package pins, typically required for high current delivery, to be reclaimed for expanded I/O functionality.
The company's advanced Power-on-Package technology enables Vertical Power Delivery (VPD) from the bottom side of the processor. VPD virtually eliminates Power Delivery Network (PDN) losses while increasing I/O capability and design flexibility.
Kyocera’s proprietary solutions look to optimise processor performance and reliability and are based on experience in package, module and motherboard manufacturing for customers worldwide.
Kyocera has considerable experience in design technology, simulation tools and manufacturing experience to provide optimal designs for complex I/O routing, high speed memory routing, and high-current power delivery.
Through this collaboration, Kyocera and Vicor will bring new solutions for AI and high-performance processor applications to market.
