Using distributed multiprocessing technology, the Clarity 3D Solver tackles electromagnetic (EM) challenges encountered when designing complex 3D structures on chips, packages, PCBs, connectors and cables by bringing 3D analysis to the engineer.
The Clarity 3D Solver reads design data from all standard chip, IC package and PCB implementation platforms while also providing integration benefits for design teams using the Cadence Allegro and Virtuoso platforms.
Highly complex structures found in silicon interposers, rigid-flex PCBs and stacked-die IC packages need to be modelled accurately in 3D for structure optimisation and high-speed signalling compliance. High-speed signalling, such as in 112G serializer/deserializer (SerDes) interfaces, relies on high-fidelity interconnect design and any slight change in impedance can negatively impact bit error rate, so optimisation entails extensive research including dozens of complex extractions and simulations.
To date, legacy field solvers have had to be run on massive, expensive high-performance servers. In addition, speed and capacity limitations of legacy field solver technology require users to carefully simplify and/or partition the structure into smaller segments to fit within local computing constraints.
In what has been a pseudo-3D approach there is the risk that the resulting final model may contain inaccuracies due to artificial effects from the superficial model boundaries.
According to Cadence, a distributed multiprocessing technology enables the Clarity 3D Solver to deliver virtually unlimited capacity and a 10X speed up required to efficiently and effectively address these larger and more complex structures. The Clarity 3D Solver creates highly accurate S-parameter models for use in signal integrity (SI), power integrity (PI) and electromagnetic compatibility (EMC) analysis, enabling simulation results that match lab measurement.
The Clarity 3D Solver has been optimised to distribute a job across multiple low-cost computers while remaining efficient when running on a more powerful and expensive server with terabytes of memory. A distributed adaptive meshing approach and significantly smaller memory requirements enable the Clarity 3D Solver to use cost-effective cloud and on-premises distributed computing.
Using the Clarity 3D Solver in conjunction with the Sigrity 3D Workbench, users will be able to merge mechanical structures such as cables and connectors with their system design and model the electrical-mechanical interconnect as a single model.
The Clarity 3D Solver is also tightly integrated with the Virtuoso, Cadence SiP Layout and Allegro implementation platforms, enabling 3D structures to be designed in the Allegro and Virtuoso environments, optimised in the analysis tool and implemented in the design tool without being redrawn.
“Our newly formed System Analysis Group is breaking new ground on next-generation algorithms to solve the most difficult electromagnetic challenges across ICs, packages, boards and complete systems,” said Tom Beckley, senior vice president and general manager of the Custom IC & PCB Group at Cadence. “This first major technology breakthrough, the Clarity 3D Solver, expands Cadence’s product portfolio beyond traditional EDA, furthering our System Design Enablement strategy and enabling us to expand our system portfolio and market opportunities.
"With the Clarity 3D Solver, semiconductor and systems companies can address system-level problems for a broad spectrum of today’s most challenging applications including 112G communication networks, IoT, automotive/ADAS, and other complex high-speed electronic systems.”
