Qualcomm's Snapdragon Automotive 5G Platform will feature a custom Micron 149 ball count multichip package, allowing for speeds of up to 20 times faster than current LTE-Advanced modems. Faster modem speeds widen the possibilities for vehicles to connect to other vehicles, roadside infrastructure and beyond.
The Snapdragon Automotive 5G Platform with integrated C-V2X direct communication technology has been designed to provide the low latency, high data speed, and more reliable cellular connection coverage that's required for next-generation connected cars and autonomous driving.
Micron created a portfolio of ultra-small 8x9.5mm, 149 ball count multichip package (MCP) solutions with SLC NAND plus LPDDR4 rated at automotive temperature grade to pair with the Snapdragon Automotive 5G Platform, creating opportunities for immersive in-vehicle experiences and automotive safety.
“5G technology will drive further innovation in connected vehicles and deliver advanced functionality that is necessary for next-generation vehicles,” said Kris Baxter, vice president of marketing for Micron’s Embedded Business Unit. “Integrating Micron’s multichip package with the Snapdragon Automotive 5G Platform will accelerate the push toward digitally enabled transportation solutions that enhance reliability and safety.”
